(a) (c) (b) (d) 1. part no. expression : (b) inductance code : 1n0 = 1.0nh (a) series code 2. c0nf igurat ion & di me ns ions : 4. mate ri als : superworld electronics (s) pte ltd (a) body : ceramic ( pb free ) (b) termination : ( pb free ) a 3. sche mati c : 5. ge ne ral sp ecif ication : c1 series pg. 1 note : specifications subject to change without notice. please check our website for latest information. 26.01.2015 0.50 0.05 bcd 1.00 0.05 a 0.50 0.05 b ag(100%) ni(100%)-1.5u m(min.) sn(100%)-3.0u m(min.) 0.25 0.10 c 1 - 1 n 0 s - ceramic chip inductors a) operating temp. : -40 c to +105 c ( including self-temperature. rise ) a d (d) 10: standard 11 ~ 99 : internal control number b c h l g 0.45~0.55 gh unit:m/m 1.50 l 0.45~0.55 recommended pc board pattern b) storage condition (component in its packaging) i) temperature : -10 to 40 c ii) humidity : 60% (c) inductance tolerence : s= 0.3nh , j= 5% , k= 10%
superworld electronics (s) pte ltd c1 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 26.01.2015 6. electrical characteristics : 100 100 100 100 100 100 100 100 100 100 100 100 test frequency ( mhz ) 100 100 C1-1N0S-10 part number typ. 300 dc resistance ( ? ) min q 8 1.0 (nh) 1.2 1.5 2.0 1.8 3.0 3.6 3.3 4.3 3.9 2.2 2.4 2.7 4.7 inductance ( mhz ) min srf rated current (ma) max 5.1 100 0.04 8 8 8 8 8 8 8 8 8 8 8 8 8 8 300 300 300 300 300 300 300 300 300 300 300 300 300 300 >13000 6000 6000 6000 6000 6000 6000 6000 6000 5000 4000 4000 4000 4000 100 100 100 100 100 300 300 300 300 300 4000 3900 3900 3700 3600 8 8 8 8 8 5.6 6.2 6.8 7.5 8.2 c1-1n2s-10 c1-1n5s-10 c1-1n8s-10 c1-2n0s-10 c1-2n2s-10 c1-2n4s-10 c1-2n7s-10 c1-3n0s-10 c1-3n3s-10 c1-3n6s-10 c1-3n9s-10 c1-4n3s-10 c1-4n7s-10 c1-5n1s-10 c1-5n6s-10 c1-6n2s-10 c1-6n8 -10 c1-7n5 -10 c1-8n2 -10 q(typ.) frequency(mhz) 100 300 500 800 1000 11 11 11 11 11 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 25 25 24 23 21 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 34 35 33 30 27 25 24 24 24 24 24 24 24 24 24 24 24 23 23 23 43 44 44 36 34 31 31 31 31 31 31 31 31 31 31 30 30 29 29 29 52 52 48 42 39 36 35 34 35 35 35 35 35 34 34 35 34 32 32 31 max. 0.08 typ. 10000 >13000 11000 10500 10000 9500 9000 8500 8000 7500 7000 6500 6000 5800 5700 5600 5500 5200 4900 0.04 0.09 0.05 0.10 0.06 0.12 0.06 0.12 0.07 0.13 0.07 0.13 0.08 0.13 0.09 0.16 0.10 0.16 0.11 0.20 0.12 0.21 0.12 0.20 0.12 0.21 0.13 0.21 0.15 0.23 0.16 0.25 0.17 0.25 0.18 0.25 0.21 0.28 100 300 3400 8 9.1 c1-9n1 -10 10 18 23 29 31 4500 0.22 0.30 100 300 3200 8 10 c1-10n -10 10 18 23 29 31 4300 0.23 0.31 100 300 2700 8 12 c1-12n -10 11 18 23 29 31 3900 0.28 0.40 100 300 2300 8 15 c1-15n -10 11 18 23 28 30 3500 0.31 0.46 100 300 2100 8 18 c1-18n -10 11 18 23 28 30 3100 0.35 0.55 100 300 1900 8 22 c1-22n -10 11 17 22 26 27 2800 0.42 0.60 100 300 1600 8 27 c1-27n -10 11 17 21 25 26 2300 0.47 0.70 100 200 1300 8 33 c1-33n -10 11 16 20 23 22 1900 0.50 0.80 100 200 1200 8 39 c1-39n -10 11 16 20 23 21 1700 0.52 0.90 100 200 1000 8 47 c1-47n -10 11 16 19 21 18 1500 0.58 1.00 100 200 750 8 56 c1-56n -10 11 16 18 18 16 1300 0.61 1.00 100 180 750 8 68 c1-68n -10 11 15 17 18 11 1200 0.70 1.20 100 150 600 8 82 c1-82n -10 10 14 16 15 6 1100 0.81 1.30 100 150 600 8 100 c1-r10 -10 10 14 14 12 - 1000 0.94 1.50 ceramic chip inductors >13000 10000
superworld electronics (s) pte ltd c1 series note : specifications subject to change without notice. please check our website for latest information. pg. 3 26.01.2015 test frequency ( mhz ) part number typ. dc resistance ( ? ) min q inductance tolerence : (nh) inductance ( mhz ) min srf rated current (ma) max q(typ.) frequency(mhz) 100 300 500 800 1000 max. typ. 100 150 600 8 120 c1-r12 -10 10 12 10 - - 800 1.10 1.60 ceramic chip inductors 100 140 550 150 c1-r15 -10 -- 920 2.57 3.20 100 130 500 180 c1-r18 -10 -- 810 2.97 3.70 100 120 450 220 c1-r22 -10 -- 700 3.29 4.20 100 110 400 270 c1-r27 -10 -- 600 3.92 4.80 8 121717 81216- 81216- 81214- j= 5% k= 10%
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 4 26.01.2015 c1 series 7. characteristics curves : ceramic chip inductors 1 10 100 1 000 10000 frequency(mhz) 0.1 1 10 100 1000 10000 im peda nce(ohm ) h ci 1 00 5f z vs freq. 6. 8n 10n 22n 47n 10 0n 1 10 100 1000 1 0000 f requ ency(mhz) 1 10 100 1000 inductance(nh) h ci 1 00 5f l vs fr eq. 6.8n 10n 22n 47n 10 0n 1 10 100 1000 10000 frequency(mhz) 1 10 100 q hci1005f q vs freq. 6. 8n 10n 22n 47 n 10 0n impedance v.s. frequency characteristics inductance v.s. frequency characteristics q v.s. frequency characteristics
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 5 26.01.2015 c1 series 8. soldering and mounti ng : 8-1. recommended pc board pattern h l g ceramic chip inductors 0.45~0.55 gh unit:m/m 1.50 l 0.45~0.55 8-2.2 soldering iron : 8-2.1 lead free solder re-flow : cannot be avoided, the preferred technique is the utilization of hot air soldering tools. mildly activated rosin fluxes are preferred. the terminations are suitable for re-flow soldering systems. if hand soldering recommended temperature profiles for lead free re-flow soldering in figure 1. (refered to j-std-020c) products attachment with a soldering iron is discouraged due to the inherent process control limitations. if a a) preheat circuit and products to 150 c. b) 350 c tip temperature for ferrite chip bead (max) c) never contact the ceramic with the iron tip soldering iron must be employed the following precautions are recommended. for iron soldering in figure 2. note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) mechanical stress when warping the board. pc board should be designed so that products can prevent damage from preheating tp(260 c/40s max.) 60~180s 4 80s max. figure 1. re-flow soldering:3 times max temperature c 150 25 200 217 time(sec.) within4~5s g rad ual cooling o ve r 60s. figure 2. wave soldering:1 times max cooling 60~150s 20~40s s olde ring natu ral cooling temperature c 150 350 preheating soldering natural re-flow soldering temperatures below 240 degrees, there will be non-wetting risk if wave soldering is used ,there will be some risk. note.
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 6 26.01.2015 c1 series may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 3. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 3 r ec 0mmendable upper limit t 8-3. solder volume ceramic chip inductors minimum fillet height = soldering thickness + 25% product height
9. packaging information : superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 26.01.2015 c1 series 9-1. reel dimension chip size chip / reel inner box middle box carton 9-3. packaging quantity material : paper 9-2 tape dimension / 8mm w:8.0 0.1 ao p p2:2 0.10 e:1.75 0.1 f:3.5 0.1 d:1.56+0.1-0.05 po:4 0.1 size ko bo t c1 0.65 0.10 ao(mm) 1.15 0.10 bo(mm) ko(mm) 0.80 max 0.80 max 2.0 0.05 p(mm) t(mm) 50000 250000 500000 c1 10000 ceramic chip inductors 9-1. reel dimension 7" x 8mm 178.0 2.0 b(mm) 60 2 9.0 0.5 a(mm) type 13.5 0.5 c(mm) d(mm) r0.5 r10.5 13.5 0.5 d b 7" x 8mm c 1 2 0 r1.9 2 0.5 a
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 8 26.01.2015 c1 series ceramic chip inductors base tape 9-4. tearing off force top cover tape 165 c to 180 c f the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. ( c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. to maintain the solderabililty of terminal electrodes : 1. storage conditions : application notice 2. transportation :
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